Electronics & Communication Engineering

About Department

The Dual Degree programme in B.Tech in Electronics and Communication Engineering and M.Tech in VLSI Designs & Technology offers an integrated five-year course of study leading to both a B.Tech and an M.Tech qualification. With an intake of 60 students per year, the programme is designed for those who wish to pursue a focused, uninterrupted path into semiconductor engineering and chip design.

The undergraduate phase grounds students in core electronics concepts—circuit theory, signals and systems, digital electronics, and communication principles. The postgraduate phase builds upon this foundation with a dedicated focus on Very Large Scale Integration design, covering the full spectrum from front-end logic design to physical layout and verification.

The department is equipped with Electronic Design Automation (EDA) tools and FPGA platforms to support both simulation and hardware implementation. Students work on projects spanning digital IC design, analog circuit synthesis, and system-on-chip integration, preparing them for roles that require both theoretical depth and practical engineering skill.

Programme Details

ProgrammeDual Degree – B.Tech (Electronics and Communication Engineering) + M.Tech (VLSI Designs & Technology)
LevelUndergraduate (UG) + Postgraduate (PG)
Duration5 Years (Integrated)
Intake60 Students per year
Annual Tuition Fee₹ 4,00,000/-

Financial Aid: For scholarship and financial aid enquiries, please contact the admissions office directly.

Areas of Study

  • Analog and Digital Circuit Design
  • Communication Systems and Signal Processing
  • CMOS and Mixed-Signal IC Design
  • Physical Design and Layout Verification
  • System-on-Chip Architecture and Embedded Integration
  • Functional Verification and Testing Methodologies

Research and Industry Engagement

The department collaborates with semiconductor companies and research institutions to provide students with exposure to industry workflows. Faculty are involved in research covering low-power design, hardware security, and advanced fabrication nodes. Students are encouraged to undertake thesis work with direct applicability to current challenges in the global semiconductor industry.